A sensor that achieves high-precision and high-speed shape measurement.
For inline inspection. Supports scanning at 70,000 points per second. Can also measure film thickness. For semiconductor wafer inspection applications.
Our company offers a system that combines the ultra-fast optical scanner 'Flying Spot Scanner (FSS)', which can perform 3D shape measurements with a maximum diameter of 80mm at high speed, with dedicated sensors. It is capable of measuring flatness, thickness, shape, and the arrangement of layers and components both vertically and horizontally with high precision and speed. We also have a wide range of sensors available, which can be selected according to the required measurement range and accuracy. 【Features of FSS】 ■ High precision: Minimum Z-direction resolution of 5nm ■ High-speed scanning: 70,000 points/second ■ Suitable for inline measurement ■ Partial measurements can be freely conducted within the measurement range *For more details, please refer to the materials. Feel free to contact us as well.
- Company：プレシテック・ジャパン
- Price：Other
